Automated Optical Testing
CBD inspection criteria meet or exceed IPC-A-610 "Acceptability of Electronic Assemblies" as well as ANSI/J-STD-001 "Requirements for Soldered Electrical and Electronic Assemblies". This is possible in part through the use of (AOI) "Automated Optical Inspection". The OMRON VT-WIN© has image resolution from 13 to 50 µm. This allows high-speed inspection of leaded components from 0.3mm pitch and 0402 chips. These inspection capabilities also apply to lead-free applications.
- Excessive Solder
- Blow Holes
- Solder Balls
- Polarity Marking
- Pin One Marking
- Lead Bends
The full spectrum, angled color-viewing system, ensures accurate results from the most challenging board layouts.
The CCD camera captures these colors as they reflect off the board's surface, producing a two-dimensional image that conveys three- dimensional information to image processing.
For further information or an on-site inspection and demonstration, call, fax, or e-mail anytime.